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N302AS EVICE 1N6117E3 AT93C86A FDB44N25 PF0032 25000 Z5SMC130
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 HVD131
Silicon Epitaxial Planar Pin Diode for Antenna Switching
REJ03G0424-0200 (Previous: ADE-208-832A) Rev.2.00 Oct 29, 2004
Features
* Low capacitance. (C = 0.8 pF max) * Low forward resistance. (rf = 1.0 max) * Super small Flat Package (SFP) is suitable for surface mount design.
Ordering Information
Type No. HVD131 Laser Mark 1 Package Code SFP
Pin Arrangement
Cathode mark Mark 1 2 1. Cathode 2. Anode
Rev.2.00 Oct 29, 2004 page 1 of 4
1
HVD131
Absolute Maximum Ratings
(Ta = 25C)
Item Peak reverse voltage Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Symbol VRM VR IF Pd Tj Tstg Value 65 60 100 150 125 -55 to +125 Unit V V mA mW C C
Electrical Characteristics
(Ta = 25C)
Item Reverse current Forward voltage Capacitance Forward resistance Note: Symbol IR VF C rf Min -- -- -- -- Typ -- -- -- -- Max 0.1 1.0 0.8 1.0 Unit A V pF Test Condition VR = 60 V IF = 10 mA VR = 1 V, f = 1 MHz IF = 10 mA, f = 100 MHz
1. Please do not use the soldering iron due to avoid high stress to the SFP package.
Rev.2.00 Oct 29, 2004 page 2 of 4
HVD131
Main Characteristic
10-2 10-7 10-8
Reverse current IR (A)
10-4
Forward current IF (A)
10-9 10-10
Ta = 50C
-11
10
-6
Ta = 50C
10-8
Ta = 25C
10
Ta = 25C
10-10
10-12 10-13 0 20 40 60 80 100 Reverse voltage VR (V) Fig.2 Reverse current vs. Reverse voltage
10-12
0
0.2
0.4
0.6
0.8
1.0
Forward voltage VF (V) Fig.1 Forward current vs. Forward voltage
103 f = 1MHz f = 100MHz
Capacitance C (pF)
Forward resistance rf ()
10
102
101
1.0
100
0.1 1.0
10 Reverse voltage VR (V)
100
10-1 10-5
10-4
10-3
10-2
Forward current IF (A) Fig.4 Forward resistance vs. Forward current
Fig.3 Capacitance vs. Reverse voltage
Rev.2.00 Oct 29, 2004 page 3 of 4
HVD131
Package Dimensions
As of January, 2003
Unit: mm
1.0 0.10 1.4 0.10
0.13 0.05
0.5 - 0.55
0.3 0.05 0.6 0.05
Package Code JEDEC JEITA Mass (reference value)
SFP -- -- 0.0010 g
Rev.2.00 Oct 29, 2004 page 4 of 4
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0


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